Cover Letter

Na-301 Bosung villa 553-2

byeongjeom-dong Hwaseong Si

Mr. Jae-hyeong Park

Human Resource Director

Intel Corporation

27-3 Yeouido-dong

Yeongdeungpo-gu Seoul Si

October 29, 2014

Dear Mr. Park

I am writing to apply for the process engineer position which was advertised in the October 12^th edition of the Seoul Si Post. I will graduate Oxford graduate school in two months with a master degree in chemical & process engineering. I believe my educational background and internship experience can contribute to Intel Corporation. My resume is enclosed.

As a soon to be graduating student in chemical & process engineering at the graduate school, I have researched and designed material process with considering global warming. Characterization of new Metal Organic Frame work absorbent material for a Pressure Swing Absorption process is the centerpiece of my thesis and this thesis got a silver prize from National Green Context through 300s competition teams. Also, as a undergraduate student, I participated in many relevant project related to the manufacturing system. Accordingly, I am confident in both my practical and theoretical understanding of the clean design process.

I am aware that Intel Corporation more expands market sharing by releasing the i-series CPU. To continue this expansion, successful communications to customers via various media will be important. I believe I can be an asset to you in this position because I have very strong presentation and communication skills that I learned at Northumbria University.

I would appreciate the opportunity to speak with you to discuss the process engineer position and the future with Intel Corporation. I am available for an interview at your convenience and can be reached at (82) 10-9171-0206 or hyunduk0206@gmail.com. Thank you and I look forward to hearing from you.

Sincerely,

Hyunduk Shin

Enclosure